Overview
The COB holographic transparent screen is based on the flip-chip COB chip packaging technology. It adopts a four-layer flexible hollow PCB substrate, 0517 large-sized LED chips, high-transparency and weather-resistant packaging glue,and micro high-precision driver IC as the four core components. This has achieved core breakthroughs in reducing power consumption by 37.5%, lowering surface temperature by 30%, reducing dead light rate by 90%, increasing viewing angle by 21%, and reducing weight by 37.5%. It funda- mentally solves the industry pain points of traditional integrated LED transparent screens through technical means. Through optical structure optimization, it realizes a holographic suspended visual effect similar to full holography, while maintaining high transparency and excellent display experience.
Key Features
- Four-layer flexible perforated PCB with high-temperature resistant substrate, over 80% perforation rate. 3-oz thick copper layer reduces thermal resistance by 60%. Etching accuracy ±5μm, bendable for irregular curved surfaces, stable signal transmission with no ghosting.
- UInverted COB LED chip (0517 large size): light-emitting area increased by over 300%,luminous efficiency ≥180lm/W, lower power consumption. 170° ultra-wide viewing angle,±2nm bin-level control for consistent color and brightness across the screen.
- High-transparency optical encapsulant : light transmittance ≥95%, reduces light loss via refractive index matching, anti-glare matte/fog effect. Bonding strength >3 MPa, IP62protection, operating temperature -10°C to 60°C, UV yellowing rate ≤1%, eco-friendly.
- Suspended visual optical design optimizes pixel arrangement and depth of field, achieving 3D suspension without holographic film, preventing cross-lighting for clear images, and ensuring uniform brightness/color within 170° viewing angle (no color shift or attenuation).
- Miniaturized 1.5*2.5mm LED driver IC ensures uniform LED emission via precise current control. Low-power design cuts energy consumption, with over-heat/ over-current protections for exceptional stability.
P3.91 Module technical parameters
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Technical parameters |
Dot pitch |
3.91(H)*3.91(V)mm |
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LED Lamp Type |
1Rx1Gx1B LED (Flip-chip) |
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Resolution |
64x384 |
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Model Size |
250(W)x150(H)mm |
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Screen Flatness |
≥2mm |
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Visual Transparency |
80° |
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Screen Parameters |
Pixel Density |
64x384 Pixels/m² |
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White Balance Luminance |
≥3300 |
|
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Viewing Angel |
170°(H) / 170°(V) |
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Evenness |
≥98% |
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Contrast Ratio |
4000:1 |
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IP Protection Level |
IP62 |
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Control parameters |
Grayscale Level |
16bit |
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Refresh rate |
≥3,840Hz |
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Brightness Adjustment Method |
Manual and automatic program control |
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Color temperature |
2,000K～9,500K /Adjustable |
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Signal Input/Operate System |
HDMI,DVI/Windows |
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Operating parameters |
Operating voltage |
AC:110V~240V,50~60Hz, 4.2V +/- 0.2V |
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Control Method |
Simultaneous and asynchronous control (Nova) |
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Continuous Dead Pixel |
0 |
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Max./Average Power Consumption |
550/165 |
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Discrete Dead Pixel/Bind Spot Rate |
≤0.001%(Factory default is 0) |
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Continuous working Time |
≥7×24h |
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MTBF |
≥10,000h |
|
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Temperature rise (during use) |
≤3° |
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Operating temperature |
-10～60℃/10%~90%RH |
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Store Environment temperarure |
-20~70℃ / 5%~95%RH |
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Anti-electromagnetic |
Complies with indoor civil electronic equipment standards |
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LED Chip Life |
≥10 thousand |
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Factory Aging Test |
≥Continuous power-on aging for 72 hours |
Scope Of Application
The product is widely used in commercial display windows, Supporting four installation methods: glass mounting, curved mounting, suspension mounting, and vertical installation, covering core B-end scenarios such as retail commerce, exhibition display, building curtain walls, and transportation hubs.
